Urmăriți
Rajen Murugan
Rajen Murugan
Adresă de e-mail confirmată pe ti.com
Titlu
Citat de
Citat de
Anul
High definition electrical impedance tomography
A Wexler, Z Mu, RM Murugan, GS Strobel
US Patent 6,745,070, 2004
1102004
High definition electrical impedance tomography methods for the detection and diagnosis of early stages of breast cancer
A Wexler, R Murugan
US Patent App. 09/991,993, 2002
762002
Millimeter wave integrated circuit with ball grid array package including transmit and receive channels
RM Murugan, M Mi, GP Morrison, J Chen, KR Rhyner, SC Beddingfield, ...
US Patent 9,666,553, 2017
592017
Integrated circuit package with emi shield
R Murugan, KR Rhyner, PR Harper, S Mukherjee
US Patent App. 12/169,908, 2010
282010
Package co-design of a fully integrated multimode 76-81ghz 45nm rfcmos fmcw automotive radar transceiver
M Mi, M Moallem, J Chen, M Li, R Murugan
2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1054-1061, 2018
132018
System-level electro-thermal analysis of RDS(ON) for power MOSFET
R Murugan, N Ai, CT Kao
2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM …, 2017
132017
Semiconductor device having wafer level chip scale packaging substrate decoupling
RM Murugan, RF McCarthy, BS Haroun, PR Harper
US Patent 7,919,860, 2011
132011
Method, system and apparatus for controlled impedance at transitional plated-through hole via sites using barrel inductance minimization
J Masuyama, R Murugan
US Patent App. 10/828,449, 2005
122005
High current packages with reduced solder layer count
Y Tang, L Wan, WT Harrison, MJ Prakuzhy, RM Murugan
US Patent 11,545,420, 2023
102023
Multiscale EMC Modeling, Simulation, and Validation of a Synchronous Step-Down DC-DC Converter
R Murugan, J Chen, A Tripathi, BP Nayak, H Muniganti, D Gope
IEEE Journal on Multiscale and Multiphysics Computational Techniques, 1-12, 2023
92023
System co-design of a 600V GaN FET power stage with integrated driver in a QFN system-in-package (QFN-SiP)
J Chen, Y Xie, D Trombley, R Murugan
2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 1221-1226, 2019
92019
Minimizing dynamic crosstalk-induced jitter timing skew
R Murugan, GK Singh
US Patent 7,680,226, 2010
92010
Method, System And Apparatus For Controlled Impedance At Transitional Plated-Through Hole Via Sites Using Barrel Inductance Minimization
J Masuyama, R Murugan
US Patent App. 11/752,032, 2007
92007
System ElectroThermal Co-Design of a Zero-Drift Current-Shunt Monitor with Precision Integrated Shunt Resistor
J Chen, R Murugan, S Kummerl, U Chaudhry, E Lim, T Shimizu, T Klumpp, ...
International Symposium on Microelectronics 2018 (1), 000193-000197, 2018
82018
Silicon-package co-design of a 45nm 200MHz bandwidth CMOS RF-to-Serdes transceiver system on chip (SoC)
M Li, T Tang, J Chen, P Litmanen, S Akhtar, R Murugan
2016 IEEE 25th Conference on Electrical Performance Of Electronic Packaging …, 2016
72016
High definition impedance imaging
A Wexler, PA O'connor, RM Murugan, Z Zheng
US Patent 8,369,941, 2013
72013
Method, system and apparatus for quantifying the contribution of inter-symbol interference jitter on timing skew budget
R Murugan, M Greim
US Patent 7,251,302, 2007
72007
Antenna-on-package including multiple types of antenna
Y Tang, RM Murugan
US Patent 11,600,932, 2023
62023
Hall-effect sensor package with added current path
M Li, Y Tang, J Chen, E Tuncer, UM Chaudhry, TR Larson, RM Murugan, ...
US Patent 10,892,405, 2021
62021
Structures and methods for capacitive isolation devices
E Tuncer, M Mi, S Sankaran, RM Murugan, V Gupta
US Patent App. 15/646,976, 2019
62019
Sistemul nu poate realiza operația în acest moment. Încercați din nou mai târziu.
Articole 1–20