| Beol-embedded 3d polylithic integration: Thermal and interconnection considerations A Kaul, SK Rajan, MO Hossen, GS May, MS Bakir 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 1459-1467, 2020 | 14 | 2020 |
| Integrated silicon microfluidic cooling of a high-power overclocked CPU for efficient thermal management SK Rajan, B Ramakrishnan, H Alissa, W Kim, C Belady, MS Bakir IEEE Access 10, 59259-59269, 2022 | 10 | 2022 |
| Microfluidic cooling of a 14-nm 2.5-D FPGA with 3-D printed manifolds for high-density computing: Design considerations, fabrication, and electrical characterization TE Sarvey, A Kaul, SK Rajan, A Dasu, R Gutala, MS Bakir IEEE Transactions on Components, Packaging and Manufacturing Technology 9 …, 2019 | 10 | 2019 |
| Monolithic microfluidic cooling of a heterogeneous 2.5-D FPGA with low-profile 3-D printed manifolds SK Rajan, A Kaul, TE Sarvey, GS May, MS Bakir IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2021 | 7 | 2021 |
| Microfabrication, coil characterization, and hermetic packaging of millimeter-sized free-floating neural probes P Yeon, SK Rajan, J Falcone, JL Gonzalez, GS May, RV Bellamkonda, ... IEEE Sensors Journal 21 (12), 13837-13848, 2021 | 7 | 2021 |
| Microfabrication, assembly, and hermetic packaging of mm-sized free-floating neural probes P Yeon, JL Gonzalez, M Zia, SK Rajan, GS May, MS Bakir, M Ghovanloo 2017 IEEE Biomedical Circuits and Systems Conference (BioCAS), 1-4, 2017 | 6 | 2017 |
| A Substrate-Agnostic, Submicrometer PSAS-to-PSAS Self-Alignment Technology for Heterogeneous Integration JL Gonzalez, SK Rajan, JR Brescia, MS Bakir IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2021 | 5 | 2021 |
| Design Considerations, Demonstration, and Benchmarking of Silicon Microcold Plate and Monolithic Microfluidic Cooling for 2.5 D ICs SK Rajan, A Kaul, T Sarvey, GS May, MS Bakir 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 1418-1426, 2021 | 5 | 2021 |
| Thermal modeling of 3D polylithic integration and implications on BEOL RRAM performance A Kaul, X Peng, SK Rajan, S Yu, MS Bakir 2020 IEEE International Electron Devices Meeting (IEDM), 13.1. 1-13.1. 4, 2020 | 4 | 2020 |
| Polylithic integration for RF/MM-Wave chiplets using stitch-chips: Modeling, fabrication, and characterization T Zheng, PK Jo, SK Rajan, MS Bakir 2020 IEEE/MTT-S International Microwave Symposium (IMS), 1035-1038, 2020 | 4 | 2020 |
| Polylithic integration of 2.5-D and 3-D chiplets enabled by multi-height and fine-pitch CMIs PK Jo, SK Rajan, JL Gonzalez, MS Bakir IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020 | 4 | 2020 |
| A die-level, replaceable integrated chiplet (PINCH) assembly using a socketed platform, compressible microinterconnects, and self-alignment JL Gonzalez, JR Brescia, T Zheng, SK Rajan, MS Bakir IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2021 | 3 | 2021 |
| Electrical characterization and benchmarking of polylithic integration using fused-silica stitch-chips with compressible microinterconnects for RF/mm-wave applications T Zheng, PK Jo, SK Rajan, MS Bakir IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2021 | 3 | 2021 |
| High density and low-temperature interconnection enabled by mechanical self-alignment and electroless plating SK Rajan, MJ Li, MS Bakir, GS May 2019 International 3D Systems Integration Conference (3DIC), 1-4, 2019 | 2 | 2019 |
| Electrical and performance benefits of advanced monolithic cooling for 2.5 D heterogeneous ICs SK Rajan, A Kaul, GS May, MS Bakir 2021 IEEE International 3D Systems Integration Conference (3DIC), 1-5, 2021 | 1 | 2021 |
| Reading bits on a CD‐ROM without a photodiode MJ Wishon, A Locquet, G Mourozeau, D Choi, S KR, A Sahai, D Citrin IET Optoelectronics 11 (5), 213-216, 2017 | 1 | 2017 |
| DENSE INTERCONNECTION AND ADVANCED COOLING TECHNOLOGIES FOR 2.5 D AND 3D HETEROGENEOUS INTEGRATED CIRCUITS S Kochupurackal Rajan Georgia Institute of Technology, 2022 | | 2022 |
| Polylithic Integrated Circuits using 2.5 D and 3D Heterogeneous Integration: Electrical and Thermal Design Considerations and Demonstrations T Zheng, A Kaul, S Kochupurackal Rajan, MS Bakir Embedded and Fan‐Out Wafer and Panel Level Packaging Technologies for …, 2022 | | 2022 |
| Reading Optical Data by Optical Feedback MJ Wishon, A Locquet, G Mourozeau, D Choi, KR Sreejith, AA Sahai, ... IS-PALD, 2017 | | 2017 |
| Advanced Packaging Technologies M Langenmair, M Hofert, M Eickenscheidt, T Stieglitz, S Wang, Z Zhong, ... | | |
Ankit KaulPhD Candidate in Electrical and Computer Engineering at Georgia Institute of TechnologyAdresă de e-mail confirmată pe gatech.edu
