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- NG Tsz-WaiCity University of Hong KongVerified email at cityu.edu.hk
- Lo Ming-FaiCity University of Hong KongVerified email at cityu.edu.hk
- Yafei ZhangShanghai jiaotong Univ.Verified email at sjtu.edu.cn
- Xiao-Ke LiuAssociate Professor at Linköping UniversityVerified email at liu.se
- Lin-Bao Luo (罗林保)Hefei University of Technology (合肥工业大学微电子学院教授)Verified email at hfut.edu.cn
- Yeshayahu LifshitzAlfred and Marion Bar Chair of Engineering, Dept. of Materials Science and Engineering, TechnionVerified email at tx.technion.ac.il
- Ziruo Hong (洪自若)Apple IncVerified email at ucla.edu
- Ruiqin ZHANGCity University of Hong KongVerified email at cityu.edu.hk
- Dapeng YUProfessor of Condensed Matter Physics and Materials Science, Peking UniversityVerified email at pku.edu.cn
- Sui-Dong WangProfessor, Institute of Functional Nano & Soft Materials (FUNSOM),Soochow UniversityVerified email at suda.edu.cn
- Yuan YaoInstitute of Physics, Chinese Academy of ScienceVerified email at iphy.ac.cn
- Shafiq.ICity University of Hong KongVerified email at my.cityu.edu.hk
- W.J. ZhangProfessor of Mechanical Engineering and Biomedical Engineering, University of SaskatchewanVerified email at usask.ca
- Zhengwei PanKing Fahd University of Petroleum and Minerals