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- Xu GAOInstitute of Functional Nano & Soft Materials (FUNSOM), Soochow University.Verified email at suda.edu.cn
- Jianlong XuInstitute of Functional Nano & Soft Materials, Soochow UniversityVerified email at suda.edu.cn
- Changhai Liu(刘长海)常州大学材料科学与工程教授Verified email at cczu.edu.cn
- Qi-Jun SunGuangdong University of Technology; City University of Hong KongVerified email at my.cityu.edu.hk
- Kazuhito TsukagoshiWPI-MANA, National Institute for Materials Science (NIMS)Verified email at nims.go.jp
- Baohua MaoSoochow University, Lawrence Berkeley National LabVerified email at mail.sim.ac.cn
- Takeo MinariNational Institute for Materials Science (NIMS)Verified email at nims.go.jp
- Tetsuhiko MiyaderaNational Institute of Advanced Industrial Sicence and Technology(AIST)Verified email at aist.go.jp
- Zhi LiuSPST, ShanghaiTech University & SIMIT, CASVerified email at shanghaitech.edu.cn
- T. K. ShamWestern University (University of Western Ontario)Verified email at uwo.ca
- Baoquan SunSoochow University, Institute of Functional Nano & Soft Materials (FUNSOM)Verified email at suda.edu.cn
- Wanli MaProfessor, Institue of Functional Nano & Soft Materials (FUNSOM), Soochow University, ChinaVerified email at suda.edu.cn
- zhenhui kang苏州大学/东北师范大学Verified email at suda.edu.cn
- Jun PengPhD, Soochow University, Australian National UniversityVerified email at suda.edu.cn
- Meng ZHANGShenzhen UniversityVerified email at szu.edu.cn
- Xueliang SunProfessor of the University of Western Ontario, Canada Research Chair, FCAE, FRSCVerified email at eng.uwo.ca
- Hai-Qiao WangNingbo Institute of Materials Technology and Engineering, Chinese Academy of SciencesVerified email at nimte.ac.cn
- Mario LanzaIEEE Fellow | Associate Professor at National University of SingaporeVerified email at kaust.edu.sa
- Kaichen ZhuKing Abdullah University of Science and Technology, University of BarcelonaVerified email at kaust.edu.sa
- Jun Li (李俊)Shanghai Jiao Tong UniversityVerified email at sjtu.edu.cn
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Sui-Dong Wang
Professor, Institute of Functional Nano & Soft Materials (FUNSOM),Soochow University
Verified email at suda.edu.cn