Serguei Stoukatch
Serguei Stoukatch
Senior Scientist, Microsys lab, University of Liege
Adresă de e-mail confirmată pe ulg.ac.be - Pagina de pornire
Citat de
Citat de
3D integration by Cu-Cu thermo-compression bonding of extremely thinned bulk-Si die containing 10 μm pitch through-Si vias
B Swinnen, W Ruythooren, P De Moor, L Bogaerts, L Carbonell, ...
2006 International Electron Devices Meeting, 1-4, 2006
Mechanical reliability of Au and Cu wire bonds to Al, Ni/Au and Ni/Pd/Au capped Cu bond pads
P Ratchev, S Stoukatch, B Swinnen
Microelectronics Reliability 46 (8), 1315-1325, 2006
An autonomous sigfox wireless sensor node for environmental monitoring
L Joris, F Dupont, P Laurent, P Bellier, S Stoukatch, JM Redouté
IEEE Sensors Letters 3 (7), 01-04, 2019
Droplet formation by squeezing in a microfluidic cross-junction
S Van Loo, S Stoukatch, M Kraft, T Gilet
Microfluidics and Nanofluidics 20, 1-12, 2016
Simultaneous Cu-Cu and compliant dielectric bonding for 3D stacking of ICs
A Jourdain, S Stoukatch, P De Moor, W Ruythooren, S Pargfrieder, ...
2007 IEEE International Interconnect Technology Conferencee, 207-209, 2007
A mass sensor based on 3-DOF mode localized coupled resonator under atmospheric pressure
Y Wang, C Zhao, C Wang, D Cerica, M Baijot, Q Xiao, S Stoukatch, ...
Sensors and Actuators A: Physical 279, 254-262, 2018
Analysis of the induced stresses in silicon during thermcompression Cu-Cu bonding of Cu-through-vias in 3D-SIC architecture
C Okoro, M Gonzalez, B Vandevelde, B Swinnen, G Eneman, S Stoukatch, ...
2007 Proceedings 57th Electronic Components and Technology Conference, 249-255, 2007
Direct gold and copper wires bonding on copper
HM Ho, W Lam, S Stoukatch, P Ratchev, CJ Vath III, E Beyne
Microelectronics Reliability 43 (6), 913-923, 2003
Flip-chip assembly of semiconductor devices using adhesives
J Vanfleteren, S Stoukatch, B Vandecasteele
US Patent 6,555,414, 2003
Evaluation of Aerosol Jet Printing (AJP) technology for electronic packaging and interconnect technique
S Stoukatch, P Laurent, S Dricot, F Axisa, L Seronveaux, D Vandormael, ...
2012 4th Electronic System-Integration Technology Conference, 1-5, 2012
Single-package 5GHz WLAN RF module with embedded patch antenna and 20dBm power amplifier
J Ryckaert, S Brebels, B Come, W Diels, D Hauspie, S Stoukatch, ...
IEEE MTT-S International Microwave Symposium Digest, 2003 2, 1037-1040, 2003
Characterisation, modelling and design of bond-wire interconnects for chip-package co-design
A Chandrasekhar, S Stoukatch, S Brebels, J Balachandran, E Beyne, ...
33rd European Microwave Conference Proceedings (IEEE Cat. No. 03EX723C) 1 …, 2003
3D-SIP integration for autonomous sensor nodes
S Stoukatch, C Winters, E Beyne, W De Raedt, C Van Hoof
56th Electronic Components and Technology Conference 2006, 5 pp., 2006
Wicking through a confined micropillar array
B Darbois Texier, P Laurent, S Stoukatch, S Dorbolo
Microfluidics and Nanofluidics 20, 1-9, 2016
A reliable and compact polymer-based package for capacitive RF-MEMS switches
Y Oya, A Okubora, M Van Spengen, P Soussan, S Stoukatch, ...
IEDM Technical Digest. IEEE International Electron Devices Meeting, 2004., 31-34, 2004
Fine pitch copper wire bonding on copper bond pad process optimization
KW Lam, HM Ho, S Stoukatch, M Van De Peer, P Ratchev, CJ Vath, ...
Proceedings of the 4th International Symposium on Electronic Materials and …, 2002
Electrical characterization of Aerosol Jet Printing (AJP) deposited conductive silver tracks on organic materials
P Laurent, S Stoukatch, F Dupont, M Kraft
Microelectronic Engineering 197, 67-75, 2018
Miniaturization using 3-D stack structure for SIP applications
S Stoukatch, M Ho, K Vaesen, T Webers, G Carchon, W De Raedt, ...
RF-MEMS technology platform for agile mobile and satellite communications
X Rottenberg, P Soussan, S Stoukatch, P Czarnecki, B Nauwelaers, ...
2006 European Microwave Conference, 1723-1726, 2006
Low-cost microfluidic device micromachining and sequential integration with SAW sensor intended for biomedical applications
S Stoukatch, LA Francis, F Dupont, M Kraft
Sensors and Actuators A: Physical 319, 112526, 2021
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