| Power integrity modeling and design for semiconductors and systems M Swaminathan, E Engin Prentice Hall, 2007 | 485 | 2007 |
| Modeling of crosstalk in through silicon vias AE Engin, SR Narasimhan IEEE transactions on electromagnetic compatibility 55 (1), 149-158, 2012 | 116 | 2012 |
| Multilayered finite-difference method (MFDM) for modeling of package and printed circuit board planes AE Engin, K Bharath, M Swaminathan IEEE Transactions on Electromagnetic Compatibility 49 (2), 441-447, 2007 | 109 | 2007 |
| Modeling of striplines between a power and a ground plane AE Engin, W John, G Sommer, W Mathis, H Reichl IEEE Transactions on Advanced Packaging 29 (3), 415-426, 2006 | 85 | 2006 |
| Finite-difference modeling of noise coupling between power/ground planes in multilayered packages and boards AE Engin, K Bharath, M Swaminathan, M Cases, B Mutnury, N Pham, ... 56th Electronic Components and Technology Conference 2006, 6 pp., 2006 | 54 | 2006 |
| Extraction of dielectric constant and loss tangent using new rapid plane solver and analytical debye modeling for printed circuit boards AE Engin IEEE Transactions on Microwave Theory and Techniques 58 (1), 211-219, 2009 | 47 | 2009 |
| Design, modeling, and characterization of embedded capacitor networks for core decoupling in the package P Muthana, AE Engin, M Swaminathan, R Tummala, V Sundaram, ... IEEE Transactions on advanced packaging 30 (4), 809-822, 2007 | 45 | 2007 |
| Power transmission lines: A new interconnect design to eliminate simultaneous switching noise AE Engin, M Swaminathan 2008 58th Electronic Components and Technology Conference, 1139-1143, 2008 | 43 | 2008 |
| Stopband analysis using dispersion diagram for two-dimensional electromagnetic bandgap structures in printed circuit boards Y Toyota, AE Engin, TH Kim, M Swaminathan IEEE Microwave and Wireless Components Letters 16 (12), 645-647, 2006 | 40 | 2006 |
| Automatic package and board decoupling capacitor placement using genetic algorithms and M-FDM K Bharath, E Engin, M Swaminathan Proceedings of the 45th annual Design Automation Conference, 560-565, 2008 | 39 | 2008 |
| Size reduction of electromagnetic bandgap (EBG) structures with new geometries and materials Y Toyota, AE Engin, TH Kim, M Swaminathan, S Bhattacharya 56th Electronic Components and Technology Conference 2006, 6 pp., 2006 | 38 | 2006 |
| Mid frequency decoupling using embedded decoupling capacitors P Muthana, M Swaminathan, E Engin, PM Raj, R Tummala IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging …, 2005 | 37 | 2005 |
| Improvements in noise suppression for I/O circuits using embedded planar capacitors P Muthana, K Srinivasan, AE Engin, M Swaminathan, R Tummala, ... IEEE Transactions on Advanced Packaging 31 (2), 234-245, 2008 | 33 | 2008 |
| Efficient sensitivity calculations for optimization of power delivery network impedance AE Engin IEEE Transactions on Electromagnetic Compatibility 52 (2), 332-339, 2010 | 32 | 2010 |
| Closed‐form network representations of frequency‐dependent RLGC parameters A Ege Engin, W Mathis, W John, G Sommer, H Reichl International journal of circuit theory and applications 33 (6), 463-485, 2005 | 31 | 2005 |
| Multilayer finite difference methods for electrical modeling of packages and printed circuit boards E Engin, M Swaminathan US Patent 7,895,540, 2011 | 29 | 2011 |
| Accurate transient simulation of interconnects characterized by band-limited data with propagation delay enforcement in a modified nodal analysis framework SN Lalgudi, E Engin, G Casinovi, M Swaminathan IEEE transactions on Electromagnetic Compatibility 50 (3), 715-729, 2008 | 28 | 2008 |
| A novel synthesis method for designing electromagnetic band gap (EBG) structures in packaged mixed signal systems TH Kim, D Chung, E Engin, W Yun, Y Toyota, M Swaminathan 56th Electronic Components and Technology Conference 2006, 7 pp., 2006 | 26 | 2006 |
| Worst-case noise prediction with non-zero current transition times for early power distribution system verification P Du, X Hu, SH Weng, A Shayan, X Chen, AE Engin, CK Cheng 2010 11th International Symposium on Quality Electronic Design (ISQED), 624-631, 2010 | 23 | 2010 |
| Prediction and comparison of high-performance on-chip global interconnection Y Zhang, X Hu, A Deutsch, AE Engin, JF Buckwalter, CK Cheng IEEE transactions on very large scale integration (VLSI) systems 19 (7 …, 2010 | 22 | 2010 |
