| Designing and modeling for power integrity M Swaminathan, D Chung, S Grivet-Talocia, K Bharath, V Laddha, J Xie IEEE Transactions on Electromagnetic Compatibility 52 (2), 288-310, 2010 | 169 | 2010 |
| Multilayered finite-difference method (MFDM) for modeling of package and printed circuit board planes AE Engin, K Bharath, M Swaminathan IEEE Transactions on Electromagnetic Compatibility 49 (2), 441-447, 2007 | 109 | 2007 |
| Reliable microstrip routing for electronics components OG Karhade, N Altunyurt, KO Lee, K Bharath US Patent 9,041,205, 2015 | 82 | 2015 |
| Finite-difference modeling of noise coupling between power/ground planes in multilayered packages and boards AE Engin, K Bharath, M Swaminathan, M Cases, B Mutnury, N Pham, ... 56th Electronic Components and Technology Conference 2006, 6 pp., 2006 | 54 | 2006 |
| Noise isolation in mixed-signal systems using alternating impedance electromagnetic bandgap (AI-EBG) structure-based power distribution network (PDN) J Choi, V Govind, M Swaminathan, K Bharath IEEE transactions on advanced packaging 33 (1), 2-12, 2009 | 47 | 2009 |
| Magnetic core inductor (MCI) structures for integrated voltage regulators AA Elsherbini, KP O'brien, H Braunisch, K Bharath US Patent 9,129,817, 2015 | 41 | 2015 |
| Automatic package and board decoupling capacitor placement using genetic algorithms and M-FDM K Bharath, E Engin, M Swaminathan Proceedings of the 45th annual Design Automation Conference, 560-565, 2008 | 39 | 2008 |
| Integrated voltage regulator efficiency improvement using coaxial magnetic composite core inductors K Bharath, K Radhakrishnan, MJ Hill, P Chatterjee, H Hariri, ... 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 1286-1292, 2021 | 26 | 2021 |
| Use of the finite element method for the modeling of multi-layered power/ground planes with small features K Bharathy, JY Choi, M Swaminathan Electronic Components and Technology Conference, 2009. ECTC 2009. 59th, 1630 …, 2009 | 26 | 2009 |
| Microelectronic assemblies having magnetic core inductors K Bharath, AA Elsherbini, SM Liff, K Radhakrishnan, Z Qian, JM Swan US Patent 11,450,560, 2022 | 24 | 2022 |
| Power delivery design and analysis of 14nm multicore server CPUs with integrated voltage regulators K Bharath, S Venkataraman 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 368-373, 2016 | 24 | 2016 |
| Microelectronic assemblies having an integrated voltage regulator chiplet AA Elsherbini, K Radhakrishnan, K Bharath, SM Liff, JM Swan US Patent 11,462,463, 2022 | 19 | 2022 |
| Low loss and low cross talk transmission lines using shaped vias AA Elsherbini, M Manusharow, K Bharath, Z Zhang, YS Mekonnen, ... US Patent 9,992,859, 2018 | 17 | 2018 |
| Package integrated power inductors using lithographically defined vias MJ Manusharow, Y Li, WJ Lambert, K Bharath, AA Elsherbini, F Eid, ... US Patent App. 14/866,852, 2017 | 16 | 2017 |
| Efficient modeling of package power delivery networks with fringing fields and gap coupling in mixed signal systems K Bharath, E Engin, M Swaminathan, K Uriu, T Yamada 2006 IEEE Electrical Performane of Electronic Packaging, 59-62, 2006 | 15 | 2006 |
| Apparatus and method to reduce power losses in an integrated voltage regulator K Bharath, S Venkataraman, WJ Lambert, MJ Hill, A Slepoy, D Zhong, ... US Patent 9,753,510, 2017 | 14 | 2017 |
| Signal and power integrity co-simulation for multi-layered system on package modules K Bharath, E Engin, M Swaminathan, K Uriu, T Yamada 2007 IEEE International Symposium on Electromagnetic Compatibility, 1-6, 2007 | 14 | 2007 |
| System level signal and power integrity analysis methodology for system-in-package applications R Mandrekar, K Bharath, K Srinivasan, E Engin, M Swaminathan Proceedings of the 43rd annual Design Automation Conference, 1009-1012, 2006 | 13 | 2006 |
| Quadruple phase watermarking during high level synthesis for securing reusable hardware intellectual property cores M Rathor, A Anshul, K Bharath, R Chaurasia, A Sengupta Computers and Electrical Engineering 105, 108476, 2023 | 12 | 2023 |
| Semiconductor package with air core inductor (aci) and magnetic core inductor (mci) AA Elsherbini, K Bharath, SA Chickamenahalli US Patent App. 13/997,042, 2014 | 12 | 2014 |
Jianyong XieGeorgia Institute of Technology, Shanghai Jiao Tong UniversityAdresă de e-mail confirmată pe gatech.edu
