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Shuilin WUPeking UniversityVerified email at pku.edu.cn
Kelvin YeungDepartment of Orthopaedics and Traumatology, The University of Hong KongVerified email at hku.hk
Xuenan GuBeihang UniversityVerified email at buaa.edu.cn
Paul K ChuChair Professor of Materials Engineering, City University of Hong KongVerified email at cityu.edu.hk
Huafang LiCurrent: University of Science and Technology Beijing; Previous: The Chinese University of Hong KongVerified email at ustb.edu.cn
Yanbo WangCurrent: Amionx Inc., Previously: Peking UniversityVerified email at amionx.com
Liyuan ShengShenzhen Institute, Peking UniversityVerified email at imr.ac.cn
C.S. LeeCity University of Hong KongVerified email at cityu.edu.hk
Ning WangHong Kong University of Science and TechnologyVerified email at ust.hk
Yinong LiuThe University of Western AustraliaVerified email at uwa.edu.au
Hoi Man WongThe University of Hong KongVerified email at hku.hk
Ming LiPhD in BiomaterialsVerified email at xwhosp.org
Professor Hong YangThe University of Western AustraliaVerified email at uwa.edu.au
Junqiang Wang (王军强)Chinese Academy of Science, Ningbo Institute of Materials Technology and EngineeringVerified email at nimte.ac.cn
Jonathan C.Y. ChungDept. of Physics & Materials Science, City University of Hong KongVerified email at cityu.edu.hk
Yeshayahu LifshitzAlfred and Marion Bar Chair of Engineering, Dept. of Materials Science and Engineering, TechnionVerified email at tx.technion.ac.il
Ruiqin ZHANGCity University of Hong KongVerified email at cityu.edu.hk
Zhong Lin WangGeorgia Tech & Beijing Institute of Nanoenergy and NanosystemsVerified email at mse.gatech.edu