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Co-authors
- Jongwon YoonKorea Institute of Materials ScienceVerified email at kims.re.kr
- Young Gon LeeSK hynixVerified email at sk.com
- Woong-Ki HongKorea Basic Science InstituteVerified email at kbsi.re.kr
- Chunhum ChoDepartment of Nanobio Materials and Electronics, Gwangju Institute of Science and TechnologyVerified email at gist.ac.kr
- Byungjin ChoChungbuk National UniversityVerified email at chungbuk.ac.kr
- Yongsung JiRice UniversityVerified email at rice.edu
- Gunuk WangKorea UniversityVerified email at korea.ac.kr
- Seok-Ju KangChungnam National UniversityVerified email at cnu.ac.kr
- Seok-In NaProfessor, Jeonbuk National University (Chonbuk National University)Verified email at jbnu.ac.kr
- Tae-Wook KimChonbuk National University (Jeonbuk National University)Verified email at jbnu.ac.kr
- Byung Hee HongSeoul National UniversityVerified email at snu.ac.kr
- Jun-Seok YeoKorea Institute of S&T Evaluation and Planning (KISTEP)Verified email at kistep.re.kr
- Robert M. WallaceUniversity of Texas at DallasVerified email at utdallas.edu
- Srikar JandhyalaEngineering Manager, Intel CorporationVerified email at intel.com
- Jiyoung KimProfessor, Department of Materials Science and Engineering, University of Texas at DallasVerified email at utdallas.edu
- Greg MordiThe University of Texas at DallasVerified email at utdallas.edu
- Manuel Quevedo-lopezUniversity of Texas at DallasVerified email at utdallas.edu
- Wootae LeeSchool of Materials Science and Engineering, Gwangju Institute of Science and Technology (GIST)Verified email at gist.ac.kr
- Bruce GnadeSMUVerified email at smu.edu
- Yonghun KimKorea Institute of Materials and Science (KIMS)
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Sangchul Lee
Postdoctoral research associate at Stevens Insitute of Technology
Verified email at stevens.edu