Woong Ho Bang
Woong Ho Bang
Bailey Tool & Mfg. Co.
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The prediction of failure pressure of gas pipeline with multi corroded region
YK Lee, YP Kim, MW Moon, WH Bang, KH Oh, WS Kim
Materials Science Forum 475, 3323-3326, 2005
Characterization of solder joint reliability using cyclic mechanical fatigue testing
CU Kim, WH Bang, H Xu, TK Lee
JOM 65, 1362-1373, 2013
Microtexture analysis of friction stir welded Al 6061-T651 plates
SH Kang, WH Bang, JH Cho, HN Han, KH Oh, CG Lee, SJ Kim
Materials Science Forum 495, 901-906, 2005
Study of fracture mechanics in testing interfacial fracture of solder joints
WH Bang, MW Moon, CU Kim, SH Kang, JP Jung, KH Oh
Journal of Electronic Materials 37, 417-428, 2008
Fracture mechanics of solder bumps during ball shear testing: effect of bump size
WH Bang, CU Kim, SH Kang, KH Oh
Journal of electronic materials 38, 1896-1905, 2009
Observation of space charge limited current by Cu ion drift in porous low-k/Cu interconnects
LS Chen, WH Bang, YJ Park, ET Ryan, S King, CU Kim
Applied Physics Letters 96 (9), 2010
The correlation between stress relaxation and steady-state creep of eutectic Sn-Pb
WH Bang, KH Oh, JP Jung, JW Morris, F Hua
Journal of electronic materials 34, 1287-1300, 2005
Texture evolution in weld regions of SUS-304 stainless steel and TRIP steel
XH Ha, SW Jang, WH Bang, US Yoon, KH Oh
Materials Science Forum(Switzerland) 408 (2), 1377-1382, 2002
Microstructure and strength of Sn-Bi coated Sn-3.5 mass% Ag solder alloy
J Lee, W Bang, J Jung, K Oh
Materials Transactions 45 (3), 783-789, 2004
Application of TLP (Transient Liquid Phase) Bonding Method to the High Tm Lead-Free Solder
JS Lee, WH Bang, JP Jung, KH Oh
Materials Science Forum 475, 1869-1872, 2005
Study of viscoplastic deformation in porous organosilicate thin films for ultra low-k applications
EH Zin, WH Bang, E Todd Ryan, SW King, CU Kim
Applied Physics Letters 102 (22), 2013
Rate dependence of bending fatigue failure characteristics of lead-free solder joint
WH Bang, LS Chen, CU Kim, TK Lee, KC Liu
2009 59th Electronic Components and Technology Conference, 2070-2074, 2009
High tensile strength of drawn gold
SH Kang, HS Jung, WH Bang, JH Cho, KH Oh, DS Kim, JS Cho, YJ Park, ...
Materials Science Forum 495, 907-912, 2005
Fracture mechanics of lead-free solder joints under cyclic shear load
H Xu, WH Bang, HT Ma, TK Lee, KC Liu, CU Kim
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010
Analysis of alligatoring behavior during roll pressing of DRI powder with flat roller and indentation-type roller
SH Joo, HJ Chang, WH Bang, HN Han, KH Oh
Materials Science Forum 475, 3223-3226, 2005
Isothermal shear fatigue mechanism of lead free solder joints
H Xu, WH Bang, HT Ma, TK Lee, KC Liu, CU Kim
2012 IEEE 62nd Electronic Components and Technology Conference, 1299-1303, 2012
Fabrication and Solderability Evaluation of SnBi Coated Sn 3. 5 wt pct Ag Alloy
JS Lee, WH Bang, JP Jung, KH Oh
Journal of the Korean Institute of Metals and Materials, 2004
Sensitivity of grain structure and fatigue reliability of Pb-free solder joint on the position in PBGA packaging assembly
H Xu, WH Bang, TK Lee, CU Kim
2012 IEEE 62nd Electronic Components and Technology Conference, 500-504, 2012
Mechanism of Microstructure Evolution and Fatigue Failure in Lead Free Solder Joint
JM Kim, WH Bang, CU Kim, TK Lee, H Ma, KC Liu
Minerals, Metals and Materials Society/AIME, 420 Commonwealth Dr., P. O. Box …, 2010
Bending fatigue characteristic of Sn-3.5 Ag solder bump on Ni-UBM
KI Kang, JP Jung, WH Bang, JH Park, KH Oh
Materials Science Forum 580, 177-182, 2008
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