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Woong Ho Bang
Woong Ho Bang
Bailey Tool & Mfg. Co.
Verified email at baileytool.com
Title
Cited by
Cited by
Year
The prediction of failure pressure of gas pipeline with multi corroded region
YK Lee, YP Kim, MW Moon, WH Bang, KH Oh, WS Kim
Materials Science Forum 475, 3323-3326, 2005
362005
Characterization of solder joint reliability using cyclic mechanical fatigue testing
CU Kim, WH Bang, H Xu, TK Lee
JOM 65, 1362-1373, 2013
272013
Microtexture analysis of friction stir welded Al 6061-T651 plates
SH Kang, WH Bang, JH Cho, HN Han, KH Oh, CG Lee, SJ Kim
Materials Science Forum 495, 901-906, 2005
252005
Study of fracture mechanics in testing interfacial fracture of solder joints
WH Bang, MW Moon, CU Kim, SH Kang, JP Jung, KH Oh
Journal of Electronic Materials 37, 417-428, 2008
232008
Fracture mechanics of solder bumps during ball shear testing: effect of bump size
WH Bang, CU Kim, SH Kang, KH Oh
Journal of electronic materials 38, 1896-1905, 2009
222009
Observation of space charge limited current by Cu ion drift in porous low-k/Cu interconnects
LS Chen, WH Bang, YJ Park, ET Ryan, S King, CU Kim
Applied Physics Letters 96 (9), 2010
162010
The correlation between stress relaxation and steady-state creep of eutectic Sn-Pb
WH Bang, KH Oh, JP Jung, JW Morris, F Hua
Journal of electronic materials 34, 1287-1300, 2005
142005
Texture evolution in weld regions of SUS-304 stainless steel and TRIP steel
XH Ha, SW Jang, WH Bang, US Yoon, KH Oh
Materials Science Forum(Switzerland) 408 (2), 1377-1382, 2002
142002
Microstructure and strength of Sn-Bi coated Sn-3.5 mass% Ag solder alloy
J Lee, W Bang, J Jung, K Oh
Materials Transactions 45 (3), 783-789, 2004
92004
Application of TLP (Transient Liquid Phase) Bonding Method to the High Tm Lead-Free Solder
JS Lee, WH Bang, JP Jung, KH Oh
Materials Science Forum 475, 1869-1872, 2005
82005
Study of viscoplastic deformation in porous organosilicate thin films for ultra low-k applications
EH Zin, WH Bang, E Todd Ryan, SW King, CU Kim
Applied Physics Letters 102 (22), 2013
72013
Rate dependence of bending fatigue failure characteristics of lead-free solder joint
WH Bang, LS Chen, CU Kim, TK Lee, KC Liu
2009 59th Electronic Components and Technology Conference, 2070-2074, 2009
72009
High tensile strength of drawn gold
SH Kang, HS Jung, WH Bang, JH Cho, KH Oh, DS Kim, JS Cho, YJ Park, ...
Materials Science Forum 495, 907-912, 2005
62005
Fracture mechanics of lead-free solder joints under cyclic shear load
H Xu, WH Bang, HT Ma, TK Lee, KC Liu, CU Kim
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010
52010
Analysis of alligatoring behavior during roll pressing of DRI powder with flat roller and indentation-type roller
SH Joo, HJ Chang, WH Bang, HN Han, KH Oh
Materials Science Forum 475, 3223-3226, 2005
52005
Isothermal shear fatigue mechanism of lead free solder joints
H Xu, WH Bang, HT Ma, TK Lee, KC Liu, CU Kim
2012 IEEE 62nd Electronic Components and Technology Conference, 1299-1303, 2012
32012
Fabrication and Solderability Evaluation of SnBi Coated Sn 3. 5 wt pct Ag Alloy
JS Lee, WH Bang, JP Jung, KH Oh
Journal of the Korean Institute of Metals and Materials, 2004
32004
Sensitivity of grain structure and fatigue reliability of Pb-free solder joint on the position in PBGA packaging assembly
H Xu, WH Bang, TK Lee, CU Kim
2012 IEEE 62nd Electronic Components and Technology Conference, 500-504, 2012
22012
Mechanism of Microstructure Evolution and Fatigue Failure in Lead Free Solder Joint
JM Kim, WH Bang, CU Kim, TK Lee, H Ma, KC Liu
Minerals, Metals and Materials Society/AIME, 420 Commonwealth Dr., P. O. Box …, 2010
12010
Bending fatigue characteristic of Sn-3.5 Ag solder bump on Ni-UBM
KI Kang, JP Jung, WH Bang, JH Park, KH Oh
Materials Science Forum 580, 177-182, 2008
12008
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