Power consumption reduction scheme of magnetic microactuation using electroplated Cu–Ni nanocomposite YW Huang, TY Chao, CC Chen, YT Cheng
Applied Physics Letters 90 (24), 2007
435 2007 Localized silicon fusion and eutectic bonding for MEMS fabrication and packaging YT Cheng, L Lin, K Najafi
Journal of microelectromechanical systems 9 (1), 3-8, 2000
332 2000 Vacuum packaging technology using localized aluminum/silicon-to-glass bonding YT Cheng, WT Hsu, K Najafi, CTC Nguyen, L Lin
Journal of Microelectromechanical Systems 11 (5), 556-565, 2002
282 2002 Process for making microstructures and microstructures made thereby L Lin, YT Cheng, K Najafi, KD Wise
US Patent 6,232,150, 2001
194 2001 Development of a flexible SU-8/PDMS-based antenna CP Lin, CH Chang, YT Cheng, CF Jou
IEEE Antennas and wireless propagation letters 10, 1108-1111, 2011
146 2011 A robust high-Q micromachined RF inductor for RFIC applications JW Lin, CC Chen, YT Cheng
IEEE Transactions on Electron Devices 52 (7), 1489-1496, 2005
113 2005 A hermetic glass-silicon package formed using localized aluminum/silicon-glass bonding YT Cheng, L Lin, K Najafi
Journal of Microelectromechanical Systems 10 (3), 392-399, 2001
108 2001 Silicon chip carrier with conductive through-vias and method for fabricating same D Edelstein, P Andry, L Buchwalter, J Casey, S Goma, R Horton, ...
US Patent App. 11/242,221, 2006
92 2006 Microstructures L Lin, YT Cheng, K Najafi, KD Wise
US Patent 6,436,853, 2002
86 2002 Comparative study of hot embossed micro structures fabricated by laboratory and commercial environments L Lin, YT Cheng, CJ Chiu
Microsystem Technologies 4, 113-116, 1998
83 1998 Formation of silicon-gold eutectic bond using localized heating method LLL Lin, YTCYT Cheng, KNK Najafi
Japanese journal of applied physics 37 (11B), L1412, 1998
74 1998 Synthesis and characterization of Ni-P-CNT's nanocomposite film for MEMS applications GR Shen, YT Cheng, LN Tsai
IEEE Transactions on Nanotechnology 4 (5), 539-547, 2005
56 2005 A low-power milliwatt electromagnetic microspeaker using a PDMS membrane for hearing aids application YC Chen, YT Cheng
2011 IEEE 24th International Conference on Micro Electro Mechanical Systems …, 2011
45 2011 A low temperature wafer-level hermetic MEMS package using UV curable adhesive ZH Liang, YT Cheng, W Hsu, YW Lee
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE …, 2004
43 2004 Localized bonding with PSG or indium solder as intermediate layer YT Cheng, L Lin, K Najafi
Technical Digest. IEEE International MEMS 99 Conference. Twelfth IEEE …, 1999
37 1999 Performance improvement of an electrothermal microactuator fabricated using Ni-diamond nanocomposite LN Tsai, GR Shen, YT Cheng, W Hsu
Journal of Microelectromechanical Systems 15 (1), 149-158, 2006
35 2006 A 37.5-mW 8-dBm-EIRP 15.5 -HPBW 338-GHz Terahertz Transmitter Using SoP Heterogeneous System Integration CH Li, TY Chao, CW Lai, WC Chen, CL Ko, CN Kuo, YT Cheng, MC Kuo, ...
IEEE Transactions on Microwave Theory and Techniques 63 (2), 470-480, 2015
34 2015 A capacitive micromachined ultrasonic transducer array for minimally invasive medical diagnosis J Chen, X Cheng, CC Chen, PC Li, JH Liu, YT Cheng
Journal of microelectromechanical systems 17 (3), 599-610, 2008
34 2008 An inkjet-printed flexible non-enzymatic lactate sensor for clinical blood plasma test YS Huang, KY Chen, YT Cheng, CK Lee, HE Tsai
IEEE Electron Device Letters 41 (4), 597-600, 2020
32 2020 The inductance enhancement study of spiral inductor using Ni–AAO nanocomposite core MC Hsu, TY Chao, YT Cheng, CM Liu, C Chen
IEEE transactions on nanotechnology 8 (3), 281-285, 2009
32 2009