Eric Beyne
Eric Beyne
Senior Fellow, VP R&D
Adresă de e-mail confirmată pe imec.be - Pagina de pornire
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Design issues and considerations for low-cost 3-D TSV IC technology
G Van der Plas, P Limaye, I Loi, A Mercha, H Oprins, C Torregiani, S Thijs, ...
IEEE Journal of Solid-State Circuits 46 (1), 293-307, 2010
Method of transferring ultra-thin substrates and application of the method to the manufacture of a multi-layered thin film device
E Beyne, A Coello-Vera, O Vendier
US Patent 6,730,997, 2004
Method of fabrication of a microstructure having an internal cavity
HAC Tilmans, E Beyne, M Van de Peer
US Patent 6,297,072, 2001
MEMS for wireless communications:‘from RF-MEMS components to RF-MEMS-SiP’
HAC Tilmans, W De Raedt, E Beyne
Journal of Micromechanics and Microengineering 13 (4), S139, 2003
3-D technology assessment: Path-finding the technology/design sweet-spot
P Marchal, B Bougard, G Katti, M Stucchi, W Dehaene, A Papanikolaou, ...
Proceedings of the IEEE 97 (1), 96-107, 2009
3D integration by Cu-Cu thermo-compression bonding of extremely thinned bulk-Si die containing 10 μm pitch through-Si vias
B Swinnen, W Ruythooren, P De Moor, L Bogaerts, L Carbonell, ...
2006 International Electron Devices Meeting, 1-4, 2006
Image sensor ball grid array package and the fabrication thereof
E Beyne, S Lerner
US Patent 6,566,745, 2003
3D system integration technologies
E Beyne
2006 International Symposium on VLSI Technology, Systems, and Applications, 1-9, 2006
Method and system for fabrication of integrated tunable/switchable passive microwave and millimeter wave modules
H Tilmans, E Beyne, H Jansen, W De Raedt
US Patent 6,876,056, 2005
3D stacked IC demonstration using a through silicon via first approach
J Van Olmen, A Mercha, G Katti, C Huyghebaert, J Van Aelst, E Seppala, ...
2008 IEEE International Electron Devices Meeting, 1-4, 2008
Method for insertion bonding and device thus obtained
E Beyne, P Limaye
US Patent 9,508,665, 2016
Hermal cycling reliability of SnAgCu and SnPb solder joints: A comparison for several IC-packages
B Vandevelde, M Gonzalez, P Limaye, P Ratchev, E Beyne
5th International Conference on Thermal and Mechanical Simulation and …, 2004
The rise of the 3rd dimension for system intergration
E Beyne
2006 International Interconnect Technology Conference, 1-5, 2006
The 3-D interconnect technology landscape
E Beyne
IEEE Design & Test 33 (3), 8-20, 2016
Bow-tie slot antenna fed by CPW
EA Soliman, S Brebels, P Delmotte, GAE Vandenbosch, E Beyne
Electronics letters 35 (7), 514-515, 1999
Multilayer thin-film MCM-D for the integration of high-performance RF and microwave circuits
G Carchon, K Vaesen, S Brebels, W De Raedt, E Beyne, B Nauwelaers
IEEE Transactions on Components and Packaging Technologies 24 (3), 510-519, 2001
Method for producing electrical through hole interconnects and devices made thereof
E Beyne, R Labie
US Patent 6,908,856, 2005
Comprehensive analysis of the impact of single and arrays of through silicon vias induced stress on high-k/metal gate CMOS performance
A Mercha, G Van der Plas, V Moroz, I De Wolf, P Asimakopoulos, N Minas, ...
2010 International Electron Devices Meeting, 2.2. 1-2.2. 4, 2010
Cu pumping in TSVs: Effect of pre-CMP thermal budget
I De Wolf, K Croes, OV Pedreira, R Labie, A Redolfi, M Van De Peer, ...
Microelectronics Reliability 51 (9-11), 1856-1859, 2011
The indent reflow sealing (IRS) technique-a method for the fabrication of sealed cavities for MEMS devices
HAC Tilmans, DJ Van de Peer, E Beyne
Journal of microelectromechanical systems 9 (2), 206-217, 2000
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