| Multiscale EMC Modeling, Simulation, and Validation of a Synchronous Step-Down DC-DC Converter R Murugan, J Chen, A Tripathi, BP Nayak, H Muniganti, D Gope IEEE Journal on Multiscale and Multiphysics Computational Techniques 8, 269-280, 2023 | 9 | 2023 |
| Black-Box DC-DC integrated circuit modeling towards design for EMC in automotive electronics N Ishibashi, LK Manepalli, D Nath, BP Nayak, S Kadam, D Gope 2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, 810-814, 2021 | 8 | 2021 |
| Circuit models for bulk current injection (BCI) clamps with multiple cables BP Nayak, A Das, SR Vedicherla, D Gope 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 …, 2018 | 8 | 2018 |
| Nonorthogonal 2.5-D PEEC for Power Integrity Analysis of Package-Board Geometries BP Nayak, SR Vedicherla, D Gope IEEE Transactions on Microwave Theory and Techniques, 2017 | 8 | 2017 |
| Model-based system-level EMI/EMC simulation for BCI pass-fail prediction BP Nayak, S Ramesh, S Rajeev, A Devi, T Tsuda, D Gope IEEE Letters on Electromagnetic Compatibility Practice and Applications 2 (2 …, 2020 | 6 | 2020 |
| Non-orthogonal 2.5 D PEEC for power integrity analysis BP Nayak, SR Vedicherla, D Gope 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium …, 2015 | 5 | 2015 |
| Black-box behavioral DC-DC converter IC emission model SR Rao, N Ishibashi, B Nayak, H Muniganti, N Ambasana, V Sahu, ... 2022 IEEE International Symposium on Electromagnetic Compatibility & Signal …, 2022 | 3 | 2022 |
| Diagnosis of radiating elements for CISPR 25 RE test setup using Huygens box method H Muniganti, B Nayak, D Gope IEEE Letters on Electromagnetic Compatibility Practice and Applications 2 (2 …, 2020 | 3 | 2020 |
| Common mode filter design for burst type pulses A Kamath, B Nayak 2016 International Conference on ElectroMagnetic Interference …, 2016 | 3 | 2016 |
| Hybrid Electromagnetic Solvers for EMIEMC BP Nayak | 2 | 2022 |
| Extension of 2.5 D PEEC for coplanar structures in power distribution network analysis BP Nayak, SR Vedicherla, D Gope 2016 IEEE 20th Workshop on Signal and Power Integrity (SPI), 1-4, 2016 | 2 | 2016 |
| Sensitivity Based Reduction of Equivalent Electrical Circuits in Power Electronics Application BP Nayak, S Dhar, A Klaedtke, J Buschbaum 2023 Joint Asia-Pacific International Symposium on Electromagnetic …, 2023 | 1 | 2023 |
| Surrogate modeling for predicting shielded cable emissions K Patra, S Cheruvalath, S Dhar, BP Nayak, A Gupta, J Hansen IEEE Transactions on Electromagnetic Compatibility 65 (1), 249-256, 2022 | 1 | 2022 |
| Practical Simulation Methods Considering Characteristic Variations of Wires for CISPR 25 Conducted Emission H Sugo, Y Sarai, BP Nayak, H Muniganti, D Gope, T Tsuda 2021 IEEE CPMT Symposium Japan (ICSJ), 78-81, 2021 | 1 | 2021 |
| Prediction of radiated emission with transmission line model for CISPR 25 S Dhar, K Patra, S Nair, L Kumar, S Krishnan, BP Nayak 2021 Asia-Pacific International Symposium on Electromagnetic Compatibility …, 2021 | 1 | 2021 |
| Effect of Cable-bend on CISPR25 CE Current Method BP Nayak, H Muniganti, H Sugo, Y Sarai, T Tsuda, D Gope 2021 Asia-Pacific International Symposium on Electromagnetic Compatibility …, 2021 | 1 | 2021 |
| Mesh-based impedance sensitivity formulation for DC/AC Power Integrity design and diagnosis N Ambasana, BP Nayak, D Gope 2016 IEEE 25th Conference on Electrical Performance Of Electronic Packaging …, 2016 | 1 | 2016 |
| Directional hybrid FEM-MoM for automotive system level simulation BP Nayak, SR Vedicherla, D Gope 2016 IEEE 25th Conference on Electrical Performance Of Electronic Packaging …, 2016 | 1 | 2016 |
| A learning-based surrogate model of conducted noise from integrated circuits (ics) under different operating conditions BP Nayak, N Ambasana, LK Manepalli, D Nath, H Muniganti, D Anant, ... US Patent App. 18/035,113, 2024 | | 2024 |
| Bulk Current Injection (BCI) Simulation and Measurement Correlation of an Automotive Battery Cell Voltages and Temperature Monitor IC J Chen, R Murugan, V Ravinuthula, W Bristiel, T Vogt, C Huang, B Nayak, ... 2023 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 1-3, 2023 | | 2023 |
