Investigation of fundamental EMI source mechanisms driving common-mode radiation from printed circuit boards with attached cables DM Hockanson, JL Drewniak, TH Hubing, TP Van Doren, F Sha, ...
IEEE Transactions on electromagnetic compatibility 38 (4), 557-566, 1996
349 1996 EMI from cavity modes of shielding enclosures-FDTD modeling and measurements M Li, J Nuebel, JL Drewniak, RE DuBroff, TH Hubing, TP Van Doren
IEEE Transactions on Electromagnetic Compatibility 42 (1), 29-38, 2000
275 2000 Electromagnetic interference (EMI) of system-on-package (SOP) T Sudo, H Sasaki, N Masuda, JL Drewniak
IEEE Transactions on Advanced Packaging 27 (2), 304-314, 2004
258 2004 Power bus decoupling on multilayer printed circuit boards TH Hubing, JL Drewniak, TP Van Doren, DM Hockanson
IEEE Transactions on Electromagnetic Compatibility 37 (2), 155-166, 1995
248 1995 Numerical modeling of electrostatic discharge generators K Wang, D Pommerenke, R Chundru, T Van Doren, JL Drewniak, ...
IEEE Transactions on electromagnetic compatibility 45 (2), 258-271, 2003
193 2003 PCB design for real-world EMI control BR Archambeault, J Drewniak
Springer Science & Business Media, 2013
176 2013 An efficient approach for power delivery network design with closed-form expressions for parasitic interconnect inductances C Wang, J Mao, G Selli, S Luan, L Zhang, J Fan, DJ Pommerenke, ...
IEEE Transactions on Advanced Packaging 29 (2), 320-334, 2006
147 2006 Quantifying SMT decoupling capacitor placement in DC power-bus design for multilayer PCBs J Fan, JL Drewniak, JL Knighten, NW Smith, A Orlandi, TP Van Doren, ...
IEEE Transactions on Electromagnetic Compatibility 43 (4), 588-599, 2001
143 2001 Modeling of shielding composite materials and structures for microwave frequencies M Koledintseva, J Drewniak, R DuBroff, K Rozanov, B Archambeault
Progress In Electromagnetics Research B 15, 197-215, 2009
135 2009 Quantifying EMI resulting from finite-impedance reference planes DM Hockanson, JL Dreniak, TH Hubing, TP Van Doren, F Sha, CW Lam
IEEE Transactions on Electromagnetic Compatibility 39 (4), 286-297, 1997
130 1997 Power-bus decoupling with embedded capacitance in printed circuit board design M Xu, TH Hubing, J Chen, TP Van Doren, JL Drewniak, RE DuBroff
IEEE Transactions on Electromagnetic Compatibility 45 (1), 22-30, 2003
123 2003 EMI from airflow aperture arrays in shielding enclosures-experiments, FDTD, and MoM modeling M Li, J Nuebel, JL Drewniak, RE DuBroff, TH Hubing, TP Van Doren
IEEE transactions on Electromagnetic Compatibility 42 (3), 265-275, 2000
122 2000 Hand-assembled cable bundle modeling for crosstalk and common-mode radiation prediction S Sun, G Liu, JL Drewniak, DJ Pommerenke
IEEE Transactions on electromagnetic compatibility 49 (3), 708-718, 2007
113 2007 Causal RLGC ( J Zhang, JL Drewniak, DJ Pommerenke, MY Koledintseva, RE DuBroff, ...
IEEE Transactions on Electromagnetic Compatibility 52 (1), 189-198, 2009
111 2009 EMI mitigation with multilayer power-bus stacks and via stitching of reference planes X Ye, DA Hockanson, M Li, Y Ren, W Cui, JL Drewniak, RE DuBroff
IEEE Transactions on electromagnetic compatibility 43 (4), 538-548, 2001
110 2001 A three-dimensional FDTD subgridding algorithm with separated temporal and spatial interfaces and related stability analysis K Xiao, DJ Pommerenke, JL Drewniak
IEEE Transactions on Antennas and Propagation 55 (7), 1981-1990, 2007
108 2007 FDTD modeling of common-mode radiation from cables DM Hockanson, JL Drewniak, TH Hubing, TP Van Doren
IEEE transactions on electromagnetic compatibility 38 (3), 376-387, 1996
101 1996 Comparison of FDTD algorithms for subcellular modeling of slots in shielding enclosures KP Ma, M Li, JL Drewniak, TH Hubing, TP Van Doren
IEEE Transactions on Electromagnetic Compatibility 39 (2), 147-155, 1997
100 1997 Susceptibility scanning as a failure analysis tool for system-level electrostatic discharge (ESD) problems G Muchaidze, J Koo, Q Cai, T Li, L Han, A Martwick, K Wang, J Min, ...
IEEE Transactions on Electromagnetic Compatibility 50 (2), 268-276, 2008
93 2008 An EMI estimate for shielding-enclosure evaluation M Li, JL Drewniak, S Radu, J Nuebel, TH Hubing, RE DuBroff, ...
IEEE Transactions on Electromagnetic Compatibility 43 (3), 295-304, 2001
92 2001 