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Co-authors
- Yan ZhouThe Chinese University of Hong Kong (shenzhen)Verified email at cuhk.edu.cn
- Jing XiaShinshu UniversityVerified email at shinshu-u.ac.jp
- Motohiko EzawaUniversity of TokyoVerified email at ap.t.u-tokyo.ac.jp
- Xiaoxi LiuProfessor, Faculty of Engineering, Shinshu UniversityVerified email at cs.shinshu-u.ac.jp
- Weisheng ZhaoFert Beijing Institute, Beihang UniversityVerified email at buaa.edu.cn
- Wang KangBeihang UniversityVerified email at buaa.edu.cn
- Oleg A. TretiakovAssociate Professor, University of New South WalesVerified email at unsw.edu.au
- Laichuan ShenBeijing Normal UniversityVerified email at mail.bnu.edu.cn
- Seonghoon WooAmogy, IBM, KIST, MITVerified email at amogy.co
- Jiang WanjunDepartment of Physics, Tsinghua UniversityVerified email at tsinghua.edu.cn
- Kang L. WangElectrical Engineering DepartmentVerified email at ee.ucla.edu
- Jörg RaabeGroup Leader, Paul Scherrer InstitutVerified email at psi.ch
- Simone FinizioPaul Scherrer InstitutVerified email at psi.ch
- Na Lei北航集成电路科学与工程学院Verified email at buaa.edu.cn
- Tae-Eon Park한국과학기술연구원Verified email at kist.re.kr
- Daoqian Zhu (朱道乾)Beihang University, ChinaVerified email at buaa.edu.cn
- Guoqiang YuInstitute of Physics, Chinese Academy of SciencesVerified email at iphy.ac.cn
- Suzanne G.E. te VelthuisArgonne National LaboratoryVerified email at anl.gov
- Axel HoffmannProfessor of Materials Science and Engineering, University of Illinois at Urbana-ChampaignVerified email at illinois.edu
- Sai LiBeihang universityVerified email at buaa.edu.cn